Image of xd7p_001
Image of xd7p_002
Image of xd7p_003

Data Center NVMe™ SSD

KIOXIA XD7P Series E1.S SSDs are designed to the Enterprise and Datacenter Standard Form Factor (EDSFF) E1.S specification to address the specific requirements of hyperscale applications, including the performance, power and thermal requirements of the Open Compute Project (OCP) Datacenter NVMe™ SSD Specification. In addition to 9.5 mm thickness E1.S, 15 mm thickness E1.S with the heatsink is also supported. Designed to optimize system density and efficiency, the XD7P Series SSDs represent the future of flash storage for servers and storage systems in cloud and hyperscale data centers, and support storage capacities up to 7.68 TB.

Documents

Key Features

  • Compliant with PCIe® 5.0 (Gen4 x4), NVMe™ 2.0 specifications
  • Open Compute Project Datacenter NVMe™ SSD specification v2.0 support (not all requirements)
  • E1.S form factor (9.5 mm / 15 mm thickness)
  • KIOXIA proprietary architecture: controller, firmware and BiCS FLASH™ generation 5
  • 1.92 TB / 3.84 TB / 7.68 TB capacity options
  • Power loss protection (PLP) and end-to-end data protection
  • Security option: SED (Self Encrypting Drive)

Key Applications

  • Servers and storage systems for cloud and hyperscale data centers

Specifications

* 表格可以水平滚动。

Base Model NumberKXDZ1RJ97T68KXDZ1RJ93T84KXDZ1RJ91T92KXDZ1RJJ7T68KXDZ1RJJ3T84KXDZ1RJJ1T92
SED Model NumberKXDZDRJ97T68KXDZDRJ93T84KXDZDRJ91T92KXDZDRJJ7T68KXDZDRJJ3T84KXDZDRJJ1T92
Capacity7,680 GB3,840 GB1,920 GB7,680 GB3,840 GB1,920 GB
Basic Specifications
Form FactorE1.S 15mmE1.S 9.5mm
lnterfacePCIe® 5.0, NVMe™ 2.0
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sustained 128 KiB Sequential Read7,200 MB/s
Sustained 128 KiB Sequential Write4,800 MB/s3,100 MB/s4,800 MB/s3,100 MB/s
Sustained 4 KiB Random Read1,550K IOPS1,650K IOPS1,500K IOPS1,550K IOPS1,650K IOPS1,500K IOPS
Sustained 4 KiB Random Write200K IOPS180K IOPS95K IOPS200K IOPS180K IOPS95K IOPS
Power Requirements
Supply Voltage12 V ± 10 %
Power Consumption (Active)20 W typ.16 W typ.20 W typ.16 W typ.
Power Consumption (Ready)5 W typ.
Reliability
MTTF2,000,000 hours
DWPD1
Dimensions
Thickness15 mm ± 0.35 mm9.5 mm ± 0.35 mm
Width33.75 mm ± 0.25 mm
Length118.75 mm ± 0.55 mm
Weight90 g Max75 g Max
Environmental
Temperature (Operating)0 °C to 75 °C
Temperature (Non-operating)-40 °C to 85 °C
Humidity (Operating)5 % to 95 % R.H.
Vibration (Operating)12 m/s2 { 1.24 Grms } ( 2 to 500 Hz )
Shock (Operating)6,864 m/s2 { 700 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • GT/s: Giga Transfers per second.
  • A kibibyte (KiB) means 2^10, or 1,024 bytes.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • DWPD: Drive Writes Per Day. One full drive write per day means the drive can be written and re-written to full capacity once a day every day for the specified lifetime. Actual results may vary due to system configuration, usage and other factors.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • Temperature (operating): Specified by the composite temperature reported by SMART.
  • SED optional model supports TCG Opal SSC except for some features. For more details, please make inquiries through “Contact us”.
  • SED optional model is not available in all countries due to the local regulations.
  • All information provided here is subject to change without prior notice.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.

Support

Download

You can download past product information, white papers, and data sheets, etc.

Introducing technical glossary related to KIOXIA's products and technology including semiconductor memory and SSD.

Contact

Please contact us if you have any technical questions, requests for materials, are interested in samples or purchases of business products (Memory, SSD), etc.