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Client SSD
NVMe™ SSD M.2

The BG4 series is a line-up of compact single package NVMe™ SSDs with capacities up to 1,024GB, and leverages a PCIe® Gen3 x4 interface and KIOXIA 96-layer TLC BiCS FLASH™. With higher bandwidth and improved flash management and Host Memory Buffer (HMB) technology, BG4 SSDs deliver best-in-class read performance in single package SSDs, of up to 2,300MB/s (sequential read) and up to 390K IOPS (random read), with active power consumption of up to 3.7W (Typ.).

The BG4 series is available in four capacities of 128GB, 256GB, 512GB and 1,024GB in surface-mount M.2 1620 single package or removable M.2 2230 module form factor options, making them suitable for thin and light system designs for ultra-thin PCs, as well as embedded devices and server boot in data centers.
The BG4 series is with the option of a Self-Encrypting Drive (SED) model supporting TCG Opal Version 2.01.

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Key Features

KIOXIA 96-layer BiCS FLASH™

PCIe® Gen3 x4, NVMe™

Capacities up to 1,024GB

M.2 1620 single package and M.2 2230 single-sided form factor

TCG Opal 2.01 Optional for SED

Key Applications

  • Ultra-mobile PCs
  • 2-in-1 notebook PCs
  • IoT/embedded devices
  • Server and storage array boot drives

Specifications

Surface mount M.2 Type 1620 single package

* 表格可以水平滚动。

Base Model NumberKBG40ZPZ1T02KBG40ZPZ512GKBG40ZPZ256GKBG40ZPZ128G
Capacity1,024 GB512 GB256 GB128 GB
Basic Specifications
Form FactorM.2 1620-S3 Single packageM.2 1620-S2 Single package
Connector Type-
lnterfacePCIe® Gen3 x4, NVMe™ 1.3b
Maximum Interface Speed32 GT/s (Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Sequential Read2,300 MB/s2,200 MB/s2,000 MB/s
Sequential Write1,800 MB/s1,400 MB/s800 MB/s
Random Read390 K IOPS330 K IOPS200 K IOPS
Random Write200 K IOPS190 K IOPS150 K IOPS
Reliability
MTTF1,500,000 hours
Power Requirements
Supply Voltage3.3 V ± 5 %, 1.8 V ±5 %,1.2 V ±5 %
Power Consumption (Active)3.4 W typ.3.1 W typ.3.2 W typ.3 W typ.
Power Consumption (L1.2 mode)5 mW typ.
Dimensions
Height1.5 mm Max.1.3 mm Max.
Width16.0 mm Max.
length20.0 mm Max.
Weight1.0 g Max.0.85 g Max.
Environmental
Temperature (Operating)0 ~ 85 °C(TSMART)
Temperature(Non-operating)-40 ~ 85 °C
Vibration (Operating/Non-operating)-
Shock (Operating/Non-operating)-
More features・Host Memory Buffer feature is supported.
・SLC cache is supported.
・Sanitize command is supported.
Removable M.2 Type 2230 module

* 表格可以水平滚动。

Base Model NumberKBG40ZNS1T02KBG40ZNS512GKBG40ZNS256GKBG40ZNS128G
Capacity1,024 GB512 GB256 GB128 GB
Basic Specifications
Form FactorM.2 2230-S3 Single-sidedM.2 2230-S2 Single-sided
Connector TypeM.2 M
lnterfacePCIe® Gen3 x4, NVMe™ 1.3b
lnterface Speed32 GT/s (Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Sequential Read2,300 MB/s2,200 MB/s2,000 MB/s
Sequential Write1,800 MB/s1,400 MB/s800 MB/s
Random Read390 K IOPS330 K IOPS200 K IOPS
Random Write200 K IOPS190 K IOPS150 K IOPS
Reliability
MTTF1,500,000 hours
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)3.7 W typ.3.5 W typ.3.6 W typ.3.4 W typ.
Power Consumption (L1.2 mode)5 mW typ.
Dimensions
Height2.38 mm Max.2.23 mm Max.
Width22.0 mm Max.
length30.0 mm Max.
Weight2.6 g Max.2.5 g Max.
Environmental
Temperature (Operating)0 ~ 85 °C(TSMART)
Temperature(Non-operating)-40 ~ 85 °C
Vibration (Operating/Non-operating)196 m/s2 { 20 G } ( Peak, 10 ~ 2,000 Hz )
Shock (Operating/Non-operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
More features・Host Memory Buffer feature is supported.
・SLC cache is supported.
・Sanitize command is supported.
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • 1 MB (megabyte) = 1,000,000 bytes.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • TSMART : Composite Temperature in SMART/Health Information
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of their respective companies.
  • All information provided here is subject to change without prior notice.

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